EPLAN Exhibiting Live Engineering Approach for SAP Product Lifecycle Management

As part of the PLM Alliance, EPLAN and sister company CIDEON will exhibit an integrated live engineering approach for SAP PLM applications.

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PLM Alliance, comprised of SAP development partners including EPLAN and sister company CIDEON, are participating in SAPPHIRE NOW and the ASUG Annual Conference May 16–18, in Orlando, FL. At booth 945, the partners will showcase the integrated live engineering approach for SAP Product Lifecycle Management (SAP PLM) application with the SAP Engineering Control Center integration tool. EPLAN’s electrical CAE system – EPLAN Electric P8 – and electronic CAD systems including Altium, Cadence and Mentor Graphics will be showcased. There will be demonstrations of interfaces to Autodesk AutoCAD and Inventor, Dassault Systemes CATIA V5 and SOLIDWORKS, PTC Creo, and Siemens NX and Solid Edge. The alliance also will give a lecture at the Live Theater with the theme “How to make engineers want SAP PLM.” SAP Engineering Control Center, the SAP integration tool for authoring tools like MCAD, ECAD and Office applications, was designed for this purpose. The presentation will highlight the benefits of an integrated SAP PLM solution and discuss efficiency gains for the extended enterprise. 

SAPPHIRE NOW and ASUG Annual Conference are the world’s premier business technology event and largest SAP customer-run conference, offering attendees the opportunity to learn and network with customers, SAP executives, partners and experts across the entire SAP ecosystem. PLM Alliance’s participation stems from the growing need among customers running SAP software to enable closed-loop engineering and the digital thread without increasing complexity of overall system architecture. The embedded SAP solutions allow cross-departmental business users to access, manage and control real-time product development data. This helps ensure that quality, time to market, and overall product development costs are managed on time and on target.


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