Mezalok Mezzanine Connectors

Rapidly evolving technologies in military electronics such as signal intelligence, radar, communications, and surveillance are driving the demand for higher data rates and increasing processing power in embedded computing solutions.

Te Mezalok Family 2014 11436640
Te Connectivity Logo 10933218

TE Connectivity (TE) launches new extensions to its rugged, high-speed Mezalok mezzanine connector family. The new extensions include a stack height of 15 mm and a new 320 position size, which fill a height gap and adds additional pin density.

  • Designed specifically for mezzanine cards in rugged applications
  • Standardized as the interconnect for XMC 2.0 (VITA 61)
  • Typical applications include application-specific high speed input/output (I/O) protocols, graphics, memory and digital-signal processing
  • At 5 GHz+, the rugged, surface-mount mezzanine connector incorporates a redundant “mini-box” four-point contact system for separable interface and ultra reliability
  • Offers signal integrity up to 10 Gb/s
  • LCP plastic housings offer thermal stability and are low-outgassing
  • Compliant BGA board attach supports standard surface mount processing and thermal stability with a contact design that provides uniform solder joints
  • Reliable four-point box contact based on M55302, supporting 500 mating cycles
  • Protected socket end for reliable blind mateability
  • Optimal thermal stability, proven to 2,000 thermal shock cycles
  • 114 position Mezalok connectors compliant to VITA 61 (XMC 2.0)
  • 10,12,15 and 18 mm stack heights
  • 60, 114 and 320 position sizes
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