TE Connectivity (TE) launches new extensions to its rugged, high-speed Mezalok mezzanine connector family. The new extensions include a stack height of 15 mm and a new 320 position size, which fill a height gap and adds additional pin density.
- Designed specifically for mezzanine cards in rugged applications
- Standardized as the interconnect for XMC 2.0 (VITA 61)
- Typical applications include application-specific high speed input/output (I/O) protocols, graphics, memory and digital-signal processing
- At 5 GHz+, the rugged, surface-mount mezzanine connector incorporates a redundant “mini-box” four-point contact system for separable interface and ultra reliability
- Offers signal integrity up to 10 Gb/s
- LCP plastic housings offer thermal stability and are low-outgassing
- Compliant BGA board attach supports standard surface mount processing and thermal stability with a contact design that provides uniform solder joints
- Reliable four-point box contact based on M55302, supporting 500 mating cycles
- Protected socket end for reliable blind mateability
- Optimal thermal stability, proven to 2,000 thermal shock cycles
- 114 position Mezalok connectors compliant to VITA 61 (XMC 2.0)
- 10,12,15 and 18 mm stack heights
- 60, 114 and 320 position sizes
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