Carbodeon nanodiamond polymeric heat sinks for LEDs can now achieve a 20% increase in polymer thermal performance.
- Uses as little as 0.03 wt. percent nanodiamond material at 45% thermal filler loading, enabling increased performance at a lower cost than with traditional fillers
- Latest refinements in materials and compound manufacturing enable 70% less nanodiamond consumption and thus, greatly reduced cost
- Performance improvements are partially derived from the extremely high thermal conductivity of diamond
- Optimized surface chemistry drives particles to disperse and become consistently integrated throughout parent materials, especially polymers
- For more demanding requirements, conductivity increases of as much as 100% can be achieved using 1.5% nanodiamond materials at 20% thermal filler loadings
- Increase in thermal conductivity is achieved without affecting electrical insulation or other mechanical properties of the material
- Well suited for a wide range of electronics and LED applications
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