Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat-resistant epoxy has superior mechanical properties.
- Serviceable over wide temperature range of -80 F to 500 F
- Provides high performance in harsh conditions
- Features solid electrical characteristics once cured
- Offers volume resistivity of 2 to 3 x 1012 ohm-cm and thermal conductivity of 9 to 10 BTU·in/ft2·hr·F at 25 C, and dielectric strength of 400 volts/mil
- Coefficient of thermal expansion exceeds 75 in/in x 10-6/C at 60 C
- Tensile strength is over 2,000 psi
- Adheres well to both metallic and non-metallic substrates
- Features long-term chemical resistance to an array of organic and inorganic chemicals
- One component system that does not require mixing
- Offers convenience of flexible cure schedules
- Typical gel time is 30 minutes at 180 F, with full cures attained in 2 to 2 1/2 hours at 300 F, which can be shortened further at higher temperatures
- Retains liquidity as long as temperature does not exceeed 180 F
- Has minimum shelf life of three months but can last as long as six months in its original unopened container
- Available in pints, quarts, gallons and five gallon containers, and is now also available in 30 gram cookies
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