Master Bond EP3UF-1 is a single component epoxy that is not premixed and frozen and is a heat curable thixotropic compound.
- Low viscosity of 5,000-15,000 cps makes well suited for underfill and many bonding applications
- Delivers high bond strength and dimensional stability
- Compressive strength of 18,000-20,000 psi (1,241.1-1,379 bar) and tensile modulus of 450,000-500,000 psi (31,026.4-34,473.8 bar)
- Thermal conductivity of 9-10 BTU•in./ft.2•hr•F [1.30-1.44 W/(m•K)], making it an effective thermal interface material
- Contains special filler with small particle size, allowing it to be applied in bond lines as thin as 10-15 microns imparting a low thermal resistance of 5-7 x 10-6 K•m2/W
- Offers superior electrical insulation with low dielectric constant of 4.5 at 60 Hz as well as high dielectric strength of 450V/mil (for 1/8 in. [0.3 cm] thick test specimen), both measured at 75 F (23.9 C)
- Single component system makes more convenient to handle, apply and store than typical two component adhesive systems
- Unlimited working life at room temperature and cures in 20-30 minutes at 250 F (121.1 C), or in 10-15 minutes at 300 F (148.9 C)
- Available for use in 10 cc syringes and 30 cc syringes, which are compatible with automated dispensing systems
- Service temperature range is -60-250 F (-51.1-121.1 C)
- Ability to bond well to various substrates such as metals, composites, ceramics and many plastics
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