Master Bond MasterSil 157 is a two component, lower viscosity silicone compound for high performance potting and encapsulation.
- Addition cured system
- Does not require exposure to air for complete cross-linking
- Features 10 to one mix ratio by weight and will not outgas while curing
- Contains no solvents and is 100% solids
- Curing occurs 12-24 hours at ambient temperatures followed by 3-5 hours at 150-200 F (65.56-93.33 C)
- Highly flexible, optically clear and retains properties over service temperature range of -175-500 F (-115-260 C)
- Capable of withstanding rigorous thermal cycling and shock
- Water resistant
- Can be used in applications involving sensitive optical and electrical components
- Specialty uses include encapsulating LEDs, optical fiber cladding and potting connectors
- Low index of refraction
- Able to transmit light from 220-2,500 nanometers
- No by-products released during cure
- Low exotherm for long pot life
- Can cure in thicknesses beyond 1 in. (2.54 cm)
- Very low shrinkage upon cure
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