Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure adhesive system.
- One component system, no mixing needed
- Secondary cure is accomplished by adding heat, with minimum temperature being 80 C (176 F)
- Epoxy based system
- Cures readily upon exposure to UV light and if there are any shadowed out areas, heating at 80 C will complete the cure
- 80 C curing feature is particularly useful given the sensitivity of many plastics to elevated temperatures
- Consistency is thixotropic, low viscosity
- Dispenses readily, but it is not as free flowing as other systems
- Cationic type cure and is not oxygen inhibited
- Bonds well to wide variety of substrates including metals, glass, ceramics and most plastics
- Good chemical resistance to many acids, bases, fuels and solvents
- Superb electrical insulator
- Able to withstand rigorous thermal cycling
- Service temperature range is -60-350 F (-51.1-176.7 C)
- Nanosilica filled system enables low shrinkage upon curing and good dimensional stability.
- Typically the UV portion occurs in 10-30 seconds at 365 nm with 10-40 milliwatts/cm2 of output
- Areas not cured because of shadowing effects can be readily cured at 80 C for 30-60 minutes
- Post curing at 125-150 C (257-302 F) for 15-30 minutes will increase the Tg
- In addition to bonding, can be used for small encapsulations as it will cure in thickness up to 0.050 in. (0.127 cm)
- Viable option for high tech aerospace, electronics, optical and specialty OEM applications
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