Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy for use in aerospace, electronics and specialty OEM industries.
- Combines user friendly processing with high physical strength profile
- Formulated for toughness, with high bond strength of over 3,200 psi and 20 pli, respectively in the shear and peel mode
- Bonds well to wide variety of substrates including metals, glass, ceramics, composites, rubbers and plastics
- Withstands aggressive thermal cycling as well as impact and shock
- Serviceable over wide temperature range of -100-400 F (-73.33-204.44 C)
- Features one to one mix ratio by weight or volume and working life of 90-120 min. for 100 g (0.22 lb.) batch
- Thorough mixing is facilitated by color coding as Part A is gray and Part B is amber
- Features high viscosity while maintaining flow properties
- Can be cured at room temperature or more rapidly at elevated temperatures
- Exhibits low shrinkage and dimensional stability upon curing
- Readily machinable
- Volume resistivity exceeds 1013 ohm-cm
- Delivers reliable electrical insulation values
- Resistant to many chemicals including water, oil and fuels, and 100% reactive
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