Master Bond EP13SPND-2 is a one part, high temperature resistant epoxy formulated primarily for high performance structural bonding applications.
- Well suited for the aerospace and specialty OEM industries
- Single component design makes it easy to handle
- Does not require mixing prior to use
- Unlimited working life at room temperature
- Paste consistency for non-drip application and to prevent flow when curing
- Offers tensile lap shear strength, compressive strength and tensile modulus of over 3,000 psi, 18,000 psi and 500,000-550,000 psi respectively
- Dimensionally stable
- Bonds well to many substrates including metals, glass, ceramics, composites, rubbers and most plastics
- Typical cured bond line thickness is 0.002-0.008 in. (0.00508-0.02032 cm)
- Electrical insulator
- Features volume resistivity exceeding 1014 ohm-cm
- Resists variety of chemicals such as fuels, oils, acids, bases and many solvents
- Serviceable over wide temperature range of -60-500 F (-51.11-260 C)
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