Master Bond Supreme 18TC Single Component Epoxy Adhesive

Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers.

• Smooth paste system
• Can be applied in bond lines as thin as 10-15 microns
• Offers exceptionally low thermal resistance of 5-7 x 10^-6 K•m²/W and thermal conductivity of 22-25 BTU•in/ft²•hr•°F [3.17-3.61 W/(m·K)]
• Offers good heat transfer capabilities
• Passes NASA low outgassing tests and can be used in applications in the aerospace, electronic, optical, specialty OEM and cryogenic industries
• Maintains high bond strength properties even when exposed to hostile environmental conditions, including high/low temperatures
• Bonds well to a wide variety of substrates including metals, composites, ceramics and plastics
• Offers tensile lap shear strength of 2,200-2,400 psi, tensile strength of 6,000-7,000 psi, t-peel strength of 5-10 pli and compressive strength of 22,000-24,000 psi
• One part system that requires no mixing
• Working life is essentially unlimited
• Requires heat curing for 60-90 minutes at 250-300 F (121.11-148.89 C)
• Post cure of a few hours at 350 F (176.67 C) will optimize performance properties
• Features low shrinkage upon curing, low CTE and high degree of dimensional stability
• Reliable electrical insulator
• Withstands thermal cycling and shock
• Serviceable over the wide temperature range of -452.47-400 F (-269.15-204.44 C)