Master Bond Supreme 18TC Single Component Epoxy Adhesive

Master Bond's Supreme 18TC epoxy adhesive features a low thermal resistance and serviceability over a wide temperature range.

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Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers.

  • Smooth paste system
  • Can be applied in bond lines as thin as 10-15 microns
  • Offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)]
  • Offers good heat transfer capabilities
  • Passes NASA low outgassing tests and can be used in applications in the aerospace, electronic, optical, specialty OEM and cryogenic industries
  • Maintains high bond strength properties even when exposed to hostile environmental conditions, including high/low temperatures
  • Bonds well to a wide variety of substrates including metals, composites, ceramics and plastics
  • Offers tensile lap shear strength of 2,200-2,400 psi, tensile strength of 6,000-7,000 psi, t-peel strength of 5-10 pli and compressive strength of 22,000-24,000 psi
  • One part system that requires no mixing
  • Working life is essentially unlimited
  • Requires heat curing for 60-90 minutes at 250-300 F (121.11-148.89 C)
  • Post cure of a few hours at 350 F (176.67 C) will optimize performance properties
  • Features low shrinkage upon curing, low CTE and high degree of dimensional stability
  • Reliable electrical insulator
  • Withstands thermal cycling and shock
  • Serviceable over the wide temperature range of -452.47-400 F (-269.15-204.44 C)
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