Master Bond's EP48TC material utilizes a unique combination of special high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 microns resulting in low thermal resistance. The lower the thermal resistance, the better it is for heat transfer properties.
- Forgiving 100 to 40 mix ratio by weight, or 100 to 50 by volume
- Upon mixing, it has a long open time with a paste consistency
- Epoxy cures at room temperature in 4 to 7 days or in 4-6 hours at 150 to 200 F; recommended cure is overnight at room temperature followed by 3 to 5 hours at 150 to 200 F
- Bonds well to a variety of substrates, including metals, composites, glass, ceramics and many plastics
- Low coefficient of thermal expansion
- Low shrinkage upon curing
- Electrical insulation properties over the temperature range of -100 to 300 F
- Tensile lap shear strength ranging from 900 to 1,100 psi
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