Master Bond EP17HT-100 is a single-part epoxy system formulated for potting, encapsulation, bonding and sealing applications.
- Cures in 60-90 min. at 200-220 F (93.33-104.44 C)
- Curing can be accelerated at higher temperatures
- Low heat curing schedule is useful in bonding applications involving temperature sensitive substrates in the aerospace, electronic, optical and other high-tech industries
- Moderate viscosity compound
- Features good flow properties
- Can be cast in sections up to 1/2 in. thick
- Not premixed and frozen, and has unlimited working life at room temperature
- Reliable electrical insulator offering volume resistivity of >1015 ohm-cm
- Dimensionally stable
- Bonds well to metals, composites, ceramics, glass and many plastics
- Tensile lap shear strength exceeds 2,700 psi (186.16 Bar) at ambient temperatures after being post cured for several hours at 350-400 F (176.67-204.44 C)
- Features chemical resistance to oils, fuels, acids, bases, water and many solvents
- Thermal conductivity is 4-5 BTU·in./(hr·ft.2·F) [0.58-0.72 W/(m·K)]
- Service temperature range is -100-500 F (-73.33-260 C)
- Naturally yellow-tan in color, but others are available
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